® COM Express Type 2 Basic Module Support Intel Socket FCPGA 998, nd TM ICES 267 2 Generation Core Mobile Processor Family Main Features ® nd Œ Type 2 COM Express Module Support 6 Express Lanes, 32 bit PCI Œ Intel 2 Generation Core™ Mobile Processors ® Interface, One IDE and Gigabit LAN Œ Intel QM67/HM65 PCH Œ 1 x DDR3 SO-DIMM Socket Product Overview ® ® nd The ICES 267 is a COM Express Type 2 basic module featuring Intel QM67/HM65 Platform Control Hub, switch supports Intel 2 generation Core™ ® Mobile processors and one DDR3 SO-DIMM memory socket up to 4GB. The ICES 267 integrated with Intel HD graphics or expands via PCI Express Graphic 1x 16 lane to carrier board; it also supports other display types include LFP or Dual channel LVDS. The high performance ICES 267 COM Express Module supports 4x SATA, 8x USB 2.0 and 6 PCIe x 1 lanes through the carrier board; and it is compatible with ICEB 8050 carrier board. Specifications CPU Support Œ Support boot from LAN, wake on LAN function nd ® Œ Support 2 generation Intel Core™ Mobile processors, socket Œ Signals down to I/O board FCPGA 998 COM Express Connector Main Memory Œ AB Œ One DDR3 1066/1333 MHz SO-DIMM, up to 8GB VGA/ LVDS/ 8 x USB 2.0/ HD Audio/ 3 x SATA/ LAN/ GPIO/ LPC bus One PCIe X4/ two PCIe X1/ SMBus (I2C)/ SPI BIOS Platform Control Hub Œ CD Œ QM67/ HM65 PCIe x 16/ IDE/ PCI BIOS Power Requirements Œ AMI System BIOS Œ +12V, +5VSB, +3.3V RTC power Œ Plug and play support Dimensions Display ® Œ 95mm (W) x 125mm (L) Œ Intel HD graphics solution Œ One PCI Express X 16 Lane down to the carried board Environment Œ Drive a standard progressive scan analog monitor with resolution up Œ Board Level Operating temperatures: 0°C to 60°C to 2048 x 1536 @ 60Hz Œ Storage temperatures: -20°C to 80°C Œ Supports LVDS 18/24-bit & single/dual channel interface Œ Relative humidity: 10% to 90% (operating, non-condensing) Audio 5% to 95% (non-operating, non-condensing) Œ HD audio interface Certifications On-board LAN ® Œ CE approval Œ Intel 82579LM Gigabit Ethernet, support iAMT 7.0 (supported with Œ FCC Class A QM67 only) COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram DDR3 Channel A DDR3 1066/1333 MHz DIMM1 Vcore Sandy Bridge IMVP 7 37.5 x37.5 mm rPGA GFXCORE Socket (rPGA988B) PCIex16 BUS FDI DMI F lexible DMI(X4) Dis play Interface VGA BUS FDI DMI DISPLAY PORT D HDA BUS DISPLAY PORT C SATA BUS PORT: 0-3 SATA BUS Cougar Point SDVO PORT B LVDS BUS QM67 25 x325 mm SATA to IDE FCBGA (Mobile only) SATA BUS SATA BUS PORT: 4 JMicron PORT: 0-7 USB2.0 BUS JMD330 S AT A B US S AT A B US P OR T : 4 LPC BUS PCI-E*1 (8) SPI BIOS TYPE 2 SPIROM TYPE 2 PCI-E*1 BUS PORT: 1,2,3,4,5,7 iAMT SPIROM PCIe to PCI INT E L W G 82579L M PCI-E*1 BUS PORT: 6 PCI-E*1 BUS PORT: 8 Bridge G bE P HY P17C9X110 Ordering Information Œ ICES 267 (P/N:10K00026700X0) ® COM Express Type 2 basic module support Intel Socket FCPGA 998, nd TM 2 generation Core mobile processor family, DDR3/ PCEex16/ PCI/ IDE/ GbE/ LVDS/ audio interface Œ ICEB 8050 (P/N: 10KB0805000X0) COM Express Type 2 evaluation board with PCIe/ PCI/ SATA/ CF/ IDE/ COM/ USB/ LVDS/ VGA/ LAN COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 01/05/2012 LPC USB (12) LVDS SATA HDA VGA SDVO DISPLAY DISPLAY SATA PCIex16 DDR3 CH A PORT B PORT C PORT D