[Print This Datasheet] Procelerant CEGM45 Core™ 2 Duo Processor COM Express Module FEATURE SUMMARY The Procelerant® CEGM45 combines the next generation performance Intel® Core™ 2 Duo processors and the GM45/GS45 chipsets with RadiSys designed dual channel memory to provide l Core™ 2 Duo and breakthrough processing performance on a basic size COM Express module. The compact 95mm x Celeron® M processor 125mm module is ideal for processing intensive applications such as medical or machine imaging options and high end test and measurement or gaming. Featuring DDR3 memory, enhanced 3D graphics, ¡ 2.53GHz and 2.26GHz and a microSD® socket, the CEGM45 is available in both Type 2 and Type 3 COM Express pin-out Core™ 2 Duo options. The CEGM45 supports existing and new carrier designs while maximizing feature content. ¡ 1.2 GHz and 1.86GHz The RadiSys Procelerant® CE family of COM Express products enable customers to start designing Core™ 2 Duo LV at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than ¡ 1.2GHz Celeron® M high speed circuit design. Planned feature changes, demand fluctuations and performance ULV upgrades can be handled without product re-designs using the Procelerant CE family. Procelerant CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime. l GM45  Express chipset and ICH9-M COM EXPERT DESIGN SERVICES l Dual-channel DDR3, up to 8GB OEMs can depend on the RadiSys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs. RadiSys COM Expert l Type 2 and Type 3 pinout services include options for software utilities, custom BIOS, mechanical models, debug assistance options and more to customers using RadiSys Procelerant® CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage. Ask your l Standard microSD socket RadiSys Sales Manager for more information. KICKSTART YOUR APPLICATION DEVELOPMENT WITH COM EXPRESS STARTER KITS Accelerate a product’s development, improve its time to market and reduce overall cost by minimizing the design team’s installation requirements and maximizing their efficiency.  Procelerant® COM Express Starter Kits arrive integrated onto a CR202 or CR203 development carrier board with heatsink, memory modules, hard drive, DVD drive, and power supply--all using only a single order code. COM EXPRESS AND REAL-TIME HYPERVISOR The greatest challenge companies face in adopting new technology is the difficulty they experience adapting it into their current products and also in utilizing it to its fullest advantage.  Multi-core processing, one of the newest technological advances in COM Express modules, operates with the greatest efficiency when utilized with RadiSys Microware® Hypervisor middleware.  One of the main benefits of Hypervisor’s innovation is the ability to run legacy software on the latest-generation platforms without going through complex porting development.  This saves time, and resources and total cost of ownership while advancing product features and functionality. Procelerant CEGM45 DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page 2 of 4  * All other trademarks are the properties of their respective owners.  Procelerant CEGM45 Specifications FEATURE FUNCTION DESCRIPTION PROCESSOR T9400 Type 2 2.53 GHz Core™ 2 Duo processor / 6MB Cache / 1067MHz FSB/ 35W SP9300 Type 2 2.26 GHz Core™ 2 Duo processor / 6MB Cache / 1067MHz FSB/ 25W SP9300 Type 3 2.26 GHz Core™ 2 Duo SV processor / 6MB Cache / 1067MHz FSB /25W SL9400 Type 2 1.86 GHz Core™ 2 Duo SV processor / 6MB Cache / 1067MHz FSB /17W  SU9300 Type 2 1.2 GHz Core™ 2 Duo processor / 3MB Cache /800MHz FSB/10W ICP722 Type 2 1.2 GHz Celeron® M processor / 1MB Cache / 800MHz FSB/5.5W CHIPSET Intel® GM45/GS45 Express Chipsets and ICH9M I/O Hub MEMORY Type Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800 Capacity Up to 4GB per channel, for a maximum of 8GB memory FLASH 4MB system flash for BIOS storage VIDEO Intel® Gen 5.0 Dual LVDS supports 2 x 18 bpp OR 2 x 24 bpp integrated graphics panel support engine VGA Default Output: SDTV/Standard Definition TV Also Supported: Composite, S-Video, Component Video, HDTV Dual-channel SDVO, multiplexed on the PCI Express Graphic port display interface Three DisplayPort, multiplexed on the PCI Express Graphic port display interface External One PCI Express x16 Graphics expansion port NETWORKING Type 2 One 10/100/1000BaseT Type 3 Two 10/100/1000BaseT AUDIO High Definition Audio Speaker Out STORAGE SATA Four SATA interfaces, each capable of supporting one SATA device Supports both 1.5 and 3.0 Gbps operation IDE (type 2 only) One IDE interface (build option) capable of supporting two UltraATA/100 devices USB microSD socket (not available on T9400) PCI EXPRESS Type 2 and 3 One x16 PCI Express Graphics expansion port Type 2 One PCI Express x1 interface Four x1 PCI Express link expansion ports, configurable as: l Four x1 l One x4 l One x2 and two x1 l One x3 and one x1 Type 3 Four x1 PCI Express link expansion ports, configurable as: l Four x1 l One x4 l One x2 and two x1 l One x3 and one x1 PCI One PCI 2.3 compliant 32-bit, 33MHz bus USB Eight USB 2.0 expansion ports USB 2.0 Debug Port on port 0 LPC One LPC interface POWER +12 power rail, primary input Supports 6.0V-16.8V (SL9400, SP9300, SU9300, ICP722) Supports 6.0V-15.5V (T9400 only) POWER ACPI 3.0 supporting states S0, S3, S4, S5, G3, and C0, C1, C2, C3, MANAGEMENT C4/C4E MISCELLANEOUS One SMBus One I2C Eight GPIO (four GPI and four GPO) BIOS Phoenix® EmbeddedBIOS® with StrongFrame® Technology OS Windows XP® Embedded Windows XP® Professional Windows Vista® Ultimate Edition Red Hat® Embedded Linux RadiSys Microware® OS-9 Microware® Hypervisor PHYSICAL SPECIFICATIONS PHYSICAL Dimensions 95mm x 125mm Compliance PICMG COM Express R1.0 Basic Form Factor ENVIRONMENT Cooling Forced air Class EAC1 as defined in the ANSI/VITA 47-2005 Conduction Class ECC1 as defined in the ANSI/VITA 47-2005 Temperature Operating Up to 2300m (7500 ft), 0 to 60C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft) Note: This Spec is based on the SKU of CEGM45T2-T94 with CEGM45-AHS. Non-operating -40°C to +85°C Shock Operating 30G, half sine shock pulse, 11ms duration, 3 times per face Non- 40G, half sine shock pulse, 11ms Operating/Unpacked duration, 3 times per face (unpackaged) Transportation/Packaged Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces Vibration Operating Random 5Hz to 2KHz, 7.7 grms, 10min (random) in each of 3 axes 5Hz - 20Hz: 0.004g2/Hz ramping up to 0.04g2/Hz 20Hz to 1000Hz: 0.04g2/Hz 1000Hz to 2000Hz: 0.04g2/Hz ramping down to 0.01g2/Hz Non-Operating/Storage Random 5Hz to 2KHz, 9.7 grms, 10min in each of 3 axes 5Hz - 20Hz: 0.006g2/Hz ramping up to 0.06g2/Hz 20Hz to 1000Hz: 0.06g2/Hz 1000Hz to 2000Hz: 0.06g2/Hz ramping down to 0.02g2/Hz Humidity Operating 5% to 95% non-condensing. 95% RH@30C, linear derating to 25% RH@60C Non-Operating/Storage 5% to 95% non-condensing Altitude Operating To 15,000ft (4570m) Non-Operating/Storage To 40,000ft (12000m) REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 Shall meet RoHS at time of production EMC EN55024, EN55022, and FCC Part 15, Subpart B, Class B WARRANTY Standard Two years, parts only Procelerant CEGM45 DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page 2 of 4  * All other trademarks are the properties of their respective owners.  Ordering Information Module Order Codes: CEGM45T2-T94-0: Type 2, 2.53GHz Core™ 2 Duo T9400 CEGM45T2-SL9-0: Type 2, 1.86GHz Core™ 2 Duo SL9400 CEGM45T2-SU9-0: Type 2, 1.2GHz Core™ 2 Duo SU9300 CEGM45T2-SP9-0: Type 2, 2.26GHz Core™ 2 Duo SP9300 CEGM45T3-SP9-0: Type 3, 2.26GHz Core™ 2 Duo SP9300 CEGM45T2-722-0: Type 2, 1.2GHz ICP722 Celeron® M ULV Supporting Products: CR202-PCIE16: Type 2, ATX development carrier, PCI Express x16 CR203-VGA: Type 3, ATX development carrier, VGA CEGM45-AHS: CEGM45 active heatsink assembly CEGM45R2-HSP: CEGM45 heatspreader assembly Starter Kits All starter kits include the following:  l 100-220V input voltage, 350W, ATX-compliant power supply l 4 GB DD3 SDRAM l 3.5" 80GB SATA hard disk drive l 5.25" 9GB 20X SATA DVD+RW combination drive l 2 SATA cables l Two power cords for use in North America and Europe l CEGM45 active heatsink assembly l Microware Hypervisor Product CD for Intel x86 multicore processors.  Please contact RadiSys for a 30-day trial license key and passwords for your preferred operating systems. S-CEGM45T2-T94-KIT l CEGM45T2-T94:  Type 2, 2.53GHz Core™ 2 Duo l CR202-PCIE16:  Type 2 carrier board with x16 PCI Express  S-CEGM45T2-SP9-KIT l CEGM45T2-SP9:  Type 2, 2.2.6GHz Core™ 2 Duo l CR202-PCIE16:  Type 2 carrier board with x16 PCI Express S-CEGM45T3-SP9-KIT l CEGM45T3-SP9:  Type 3, 2.26GHz Core™ 2 Duo l CR203-VGA:  Type 3 carrier board with VGA S-CEGM45T2-SL9-KIT l CEGM45T2-SL9:  Type 2, 1.86GHz Core™ 2 Duo l CR202-PCIE16:  Type 2 carrier with x16 PCI Express S-CEGM45T2-SU9-KIT l CEGM45T2-SU9:  Type 2, 1.2GHz Core™ 2 Duo l CR202-PCIE16:  Type 2 carrier with x16 PCI Express S-CEGM45T2-722-KIT: l CEGM45T2-722:  Type 2, 1.2GHz Celeron® M ULV l CR202-PCIE16:  Type 2 carrier with x16 PCI Express 2009 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CEGM45 DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page 4 of 4