[Print This Datasheet] Procelerant CE945GME Core™ 2 Duo Pentium M 945GME COM Express Module FEATURE SUMMARY Based on the open PICMG standard, the RadiSys Procelerant™ CE945GME COM Express basic � Core™ 2 Duo, Core Duo, and size (95mm x 125mm) modules combine Intel® Core™2 Duo Pentium M and single core Celeron M Celeron processor options performance with dual channel memory that's vital for today’s embedded applications. Paired with a RadiSys Procelerant carrier board, RadiSys COM Express modules provide a ready-to-use � Type 2 COM Express Pin-out development platform � Dual-channel DDR2, up to 4GB PICMG STANDARD memory COM Express is the PICMG standard for a Computer-On-Module (COM) based on high speed serial differential signaling technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial DVO while retaining legacy PCI bus support to ease migration from existing modular designs. COM Express enables OEMs to reduce time to market by reducing the time spent on processor design and enabling focus on core competencies and product differentiation. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re-designs. COM Express modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime. APPLICATIONS Core 2 Duo processing power combined with dual channel memory on a basic (95 x 125mm) size module brings unprecedented processing power to the mighty but small CE945GME computer-on- module. Dual channel memory via 2 SODIMM sockets provides up to 67% performance increase over single channel memory solutions, making the CE945GME an ideal choice for processing intensive applications such as medical and machine imaging. OEMs can build imaging systems with performance levels that span years into the future by using one or more CE945GMEs on their carrier and planning modular hardware and software upgrades in the future. CARRIER DESIGNS SUPPORTED BY RADISYS OEMs can depend on RadiSys to support their design at every stage, whether designing their own carrier board or utilizing RadiSys Design Services. Design tools such as the Carrier Design Guide, Thermal Design Guide, as well as schematics and Gerber files are available for customers committed to using RadiSys Procelerant CE processor modules. Ask your RadiSys Sales Manager for more information. Procelerant CE945GME Specifications FEATURE FUNCTION DESCRIPTION PHYSICAL Dimensions 95mm x 125mm – COM Express Basic Form Factor Compliance PICMG COM Express R1.0 Basic Form Factor, Type 2 PROCESSOR Options Intel Core 2 Duo L7400 LV Intel Core Duo T2500 Intel Core Duo L2400 LV Intel Celeron-M 440 Clock Speed/ FSB / Cache L7400: 1.5GHz / 667MHz FSB / 4MB T2500: 2GHz / 667MHz FSB / 2MB L2400: 1.66GHz / 667MHz FSB / 2MB 440: 1.86GHz/533MHz/FSB/1MB Package BGA Power (Processor TDP) L7400-17W / T2500-31W / L2400 -15W / 440- 27W CHIPSET Supplier Intel 945GME and ICH7M Digital Home Controller Hub Features Integrated video, PCI, IDE, PCI-Express, SATA, USB, LPC, GPIO MEMORY Type Dual 200-pin SODIMM sockets, supports 533, and 667MHz Memory Capacity Up to 2GB DDR2 per channel BIOS Type 1MB, Phoenix Technologies AUDIO Compliance AC‘97 or Intel High Definition Audio via ICH7M Digital Home VIDEO Features Dual SDVO, LVDS 18-bit dual channel, Analog VGA, TV Out External PCI-Express x16 Graphics Port, Multi-plexed on SDVO interface pins NETWORKING Supplier/Type Broadcom BCM5789, IEEE 802.3 10/100/1000BaseT Utilizes (1) PCI-Express x1 interface I/O USB Eight USB 2.0 / 1.1 Ports SATA Two SATA 150 Ports, Supports Raid 0 and Raid 1 IDE One Ultra ATA 100/66/33 Ports Other LPC, Smbus/I2C Bus, SUPER I/O BIOS Support National Semiconductor PC8374 EXPANSION PCI Express 5*PCI-Express x1 or 1*PCI-Express x4 plus 1* x1 and 1*PCI-Express x16 PCI PCI 2.3 32-bit 33MHz, four logical devices CONNECTORS COM Express (2) 220 pin COM Express standard connectors POWER Input 12V only -or- 12V and 5V Standby Dissipation L7400-46W / T2500-63.5W / L2400 -43.5W / 440-58W PHYSICAL SPECIFICATIONS ENVIRONMENT Temperature Operating 0° – 60°C Non-Operating -40° – 85°C Humidity Operating 0%-95% RH non-condensing Non-Operating 0% - 90% RH non-condensing at 40C° Shock Operating 20g, 11ms, half sine Non-Operating (unpackaged) 40g, 11ms, half sine Vibration Operating 5-100Hz, 0.04 g2/Hz 100-350Hz 0.0002 g2/Hz 500Hz 0.00014 g2/Hz 3dB per octave slope between 350—500Hz Non-Operating (unpackaged) 5-100Hz, 0.04 g2/Hz 200-350Hz 0.0100 g2/Hz 500Hz 0.0007 g2/Hz 3dB per octave slope between 100-200 and 350—500Hz REGULATORY Safety UL60950-1, EN60950-1, IEC60950-1 EMC EN55022, EN55024, and FCC Part 15, Subpart B, Class B ROHS ROHS Compliant WARRANTY Standard Two years, parts only Ordering Information Call for pricing and availability. Refer to the order codes below. DESCRIPTION: Module Order Codes: CE945GM2B-L74-0: 1.5GHz Core 2 Duo LV L7400 CE945GM2B-T25-0: 2GHz Core Duo T2500 CE945GM2B-L24-0 1.66GHz Core Duo LV L2400 CE945GM2B-440-0 1.86GHz Celeron-M Supporting Products: CR100-2DVI- FlexATX Carrier with Dual DVI CR100-PCIE16 - FlexATX Carrier with PCI Express x16 CE945GM2-HSP: Heatspreader CE945GM2-PHS: Passive heat sink CE945GM2-AHS12: 25mm active heatsink assembly CE945GM2-AHSL: 26mm active heatsink assembly CE-TIM: Thermal Interface Material CE-DVI-VGA: DVI to VGA Cable © 2010 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. Procelerant CE945GME DATA SHEET | © 2010 RadiSys Corporation * All other trademarks are the properties of their respective owners.