RADISYS CE760-0
Specifications
System Chipset
Intel ICH
Form Factor
COM Express
Ethernet Chipset
Intel 82573
Video Chipset
Intel 915GM
Audio Compliance
AC ‘97 Intel High Definition Audio via ICH6M I/O Hub
BIOS
Support National Semiconductor PC8374, Ask about support for Winbond W83627HF-AW
BIOS Type
1MB, Phoenix Technologies
Capacity
Up to 1GB DDR2 in a single channel (Market Availability)
Chipset
Intel 915GM with ICH6M I/O Hub
Compliance
PICMG COM Express R1.0 Basic Form Factor, Type 2
Connectors
COM Express (2) 220 pin COM Express standard connectors. Module connector pn: Tyco 3-1827231-6, Carrier connector pn: Tyco 3-3-1827233-6
Dimensions
95mm x 125mm - COM Express Basic Form Factor
Dissipation 3D Mark (Max)
CE 760: 30.3W CE370: 26.5W
Environment Temperature
0º – 60ºC (operation), -40º – 85º (non-operating)
External
PCI-Express x16 Graphics Port, Multi-plexed on SDVO interface pins
Features
Dual SVDO, LVDS 18-bit dual channel, Analog VGA, TV Out
Integrated video, PCI, IDE, PCI-Express, SATA, USB, LPC, GPIO
Humidity
5% to 95% Condensing (Operating), 5% – 90% RH Non-Condensing at 40C
IDE
One Ultra ATA100/66/33 port
Memory Type
Single 200-pin SO-DIMM socket, supports 400 and 533 Memory
Networking Type
IEEE 802.3 10BASE-T/100BASE-TX/1000BASE-T Compliant Physical Layer via Intel 82573V - Utilizes (1) PCI-Express x1 interfaces
OTHER
LPC, Smbus/I2C Bus
Package
BGA
PCI
PCI 2.3 32-bit 33MHz, four logical devices
PCI Express
3*PCI-Express x1 and 1*PCI-Express x16
Performance Clock Speed/FSB/Cache
2GHz/533MHz FSB / 2MB Cache
Power
27W / 21W / 10W / 5W (Processor only)
Power Input
12V input from carrier board (5V standby)
Processor
Intel Pentium M
Intel Pentium M 760, LV Pentium-M 738, Celeron M 370, ULV Celeron-M 373
SATA
Two SATA 150 ports
Shock
30G, trapezoidal 11ms duration
USB
Eight USB 2.0 / 1.1 ports
Vibration Operating
30G, half sine 11ms duration, Storage: 50G, half sine 11ms duration 30G
Video Type
Dual Independent Displays via Intel 915GM Chipset
Features
- 1 ATA 100 Port
- 125mm)
- 1GB DDR2 Memory
- 2 SATA Ports
- 2GHz Pentium M and 1.5GHz
- 3*PCI-Express x1 PCI Express
- 8 GPIO Lines
- 8 USB Ports
- Analog VGA
- Basic Form Factor (95mm x
- Celeron M combined with
- COM Express Standard Features
- Dual SDVO
- Ethernet Controller
- Express Module
- Flexible PCI-Express Options
- Hat Desktop Linux
- Heatskinks Available
- Integrated Graphics
- Intel 82573 10/100/1000BaseTX
- Intel 915GM Chipset on COM
- Intel ICH6M I/O Hub
- LVDS
- One SODIMM Socket for up to
- Optimized Passive and Active
- PCI 32-bit/33MHz PCI Bus
- Phoenix BIOS with ACPI 2.0
- PICMG COM Express Compliant
- Ports
- Power Management
- TV out
- Type 2 COM Express Pin-out
- Win XP/Win XP Embedded/Red
Datasheet
Extracted Text
PROCELERANT CE 915GM COM Express Embedded Computing Module PRODUCT DESCRIPTION Based on the open PICMG® standard, the RadiSys Procelerant™ CE COM Express module combines Intel® Pentium® M and Celeron® M performance with key features vital for today’s embedded applications. Paired with a RadiSys Procelerant™ CR carrier board, the RadiSys family of COM Express modules provides a final production or a design-specific development platform. FEATURE SUMMARY PICMG STANDARD 2GHz Pentium® M and 1.5GHz COM Express is the PICMG standard for a Computer-On-Module (COM) based on new serial differential signaling Celeron® M combined with technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial DVO. The COM Express modular Intel® 915GM Chipset on COM concept enables OEMs to reduce time to market by reducing the time spent on processor design and enabling Express Module OEMs to focus on their core competencies and product differentiation. The modularity provides the ability for an Intel ICH6M I/O Hub OEM to plan for feature changes, contributing to the success of the product over its lifetime. PICMG COM Express Compliant Basic Form Factor (95mm x APPLICATIONS 125mm) RadiSys COM Express products are ideal for embedded applications that require a standard processor and Type 2 COM Express Pin-out memory subsystem at the center fo their design – and require the modular flexiblity to meet customer needs. Intel 82573 10/100/1000BaseTX Other ideal applications include designs that are size constrained and require the small footprint of COM Express. Ethernet Controller One SODIMM Socket for up to CARRIER DESIGNS SUPPORTED BY RADISYS 1GB DDR2 Memory Whether customers design their own carrier board or utilize RadiSys Design Services to design one, RadiSys Flexible PCI-Express Options supports the design each step of the way. Tools such as the Carrier Design Guide and Thermal Design Guide, as 3*PCI-Express x1 PCI Express well as schematics and Gerber files are available for customers committed to using RadiSys Procelerant™ CE Ports processor modules. Ask you RadiSys Sales Manager for more information. Integrated Graphics Dual SDVO Analog VGA LVDS TV out COM Express Standard Features 8 USB Ports 2 SATA Ports 1 ATA 100 Port PCI 32-bit/33MHz PCI Bus 8 GPIO Lines Phoenix BIOS with ACPI 2.0 Power Management Win XP/Win XP Embedded/Red Hat Desktop Linux Optimized Passive and Active Heatskinks Available ROHS Compliant PROCELERANT CE 915GM DATA SHEET | © 2006 RadiSys Corporation | ID: 10-27-2006 2 | Page 1 of 3 Procelerant CE 915GM Specifications Feature Function Description Physical Dimensions 95mm x 125mm - COM Express Basic Form Factor Compliance PICMG COM Express R1.0 Basic Form Factor, Type 2 Processor Options Intel® Pentium® M 760, LV Pentium-M 738, Celeron® M 370, ULV Celeron®-M 373 Performance Clock Speed/FSB/Cache CE760 Pentium®-M: 2GHz/533MHz FSB / 2MB Cache CE370 Celeron®-M: 1.5GHz /400MHz FSB / 1MB Caches CE738 LV Pentium®-M: 1.4GHz/400MHz FSB/2MB Cache CE373 ULV Celeron®-M: 1.0GHz /400MHz FSB / 512MB Cache Package BGA Power 27W / 21W / 10W / 5W (Processor only) Chipset Supplier Intel® 915GM with ICH6M I/O Hub Features Integrated video, PCI, IDE, PCI-Express, SATA, USB, LPC, GPIO Memory Type Single 200-pin SO-DIMM socket, supports 400 and 533 Memory Capacity Up to 1GB DDR2 in a single channel (Market Availability) BIOS Type 1MB, Phoenix Technologies Audio Compliance AC ‘97 Intel High Definition Audio via ICH6M I/O Hub Video Type Dual Independent Displays via Intel 915GM Chipset Features Dual SVDO, LVDS 18-bit dual channel, Analog VGA, TV Out External PCI-Express x16 Graphics Port, Multi-plexed on SDVO interface pins Networking Type IEEE 802.3 10BASE-T/100BASE-TX/1000BASE-T Compliant Physical Layer via Intel 82573V - Utilizes (1) PCI-Express x1 interfaces I/O USB Eight USB 2.0 / 1.1 ports SATA Two SATA 150 ports IDE One Ultra ATA100/66/33 port OTHER LPC, Smbus/I2C Bus Super I/O BIOS Support National Semiconductor PC8374, Ask about support for Winbond W83627HF-AW Expansion PCI Express 3*PCI-Express x1 and 1*PCI-Express x16 PCI PCI 2.3 32-bit 33MHz, four logical devices Connectors COM Express (2) 220 pin COM Express standard connectors. Module connector pn: Tyco 3-1827231-6, Carrier connector pn: Tyco 3-3-1827233-6 Power Input 12V input from carrier board (5V standby) Dissipation: CE 760: 30.3W CE370: 26.5W 3D Mark (Max) CD738: 20.7W CE373: 16.9W Environment Temperature 0º – 60ºC (operation), -40º – 85º (non-operating) Humidity 5% to 95% Condensing (Operating), 5% – 90% RH Non-Condensing at 40C Shock 30G, trapezoidal 11ms duration Vibration Operating: 30G, half sine 11ms duration, Storage: 50G, half sine 11ms duration 30G Regulatory Safety UL60950-1, EN60950-1, IEC60950-1 EMC EN55022, EN55024 and FCC Part 15, Subpart B, Class B. Warranty - Two years PROCELERANT CE 915GM DATA SHEET | © 2006 RadiSys Corporation | ID: 10-27-2006 2 | Page 2 of 3 Ordering Information Toll-Free: 800-950-0044 Phone: 503-615-1100 Support: 866-385-6167 Call for pricing and availability. Refer to the order codes below. ORDER CODES/description: Module Order Codes: CE760-0 2.0GHz Pentium M, 0MB Contact Information CE738-0 1.4GHz LV Pentium M, 0MB CE370-0 1.5GHz Celeron-M, 0MB www.radisys.com CE373-0 1.0GHz ULV Celeron-M, 0MB info@radisys.com CE760-512 2.0GHz Pentium M, 512MB Channels and other locations CE738-512 1.4GHz LV Pentium M, 512MB CE370-512 1.5GHz Celeron M, 512MB CE373-512 1.0GHz ULV Celeron M, 512MB Supporting Products: World Headquarters CR100-2DVI: Development ATX Carrier Board with Dual DVI Connectors 5445 NE Dawson Creek Dr. Hillsboro, OR 97124 USA CR100-PCIE16: Development ATX Carrier Board with 16-bit Phone: 503-615-1100 PCI-Express Fax: 503-615-1121 CE-AHS: Active Heatsink & Assembly Toll-Free: 800-950-0044 CE-PHS: Passive Heatsink & Assembly Support: 866-385-6167 CE-PHS17: Low Profile Passive CE-TIM: Thermal Interface Material, required with Heatsinks CE-DVI-VGA: DVI to VGA cable 2006 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within this document are subject to change without notice. PROCELERANT CE 915GM DATA SHEET | © 2006 RadiSys Corporation | ID: 10-27-2006 2 | Page 3 of 3
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What they say about us
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Bucher Emhart Glass
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Fuji
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Applied Materials
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TERRIFIC RESOURCE
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Trican Well Service
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ConAgra Foods