® ICES 300 Intel Socket P, Core™ 2 Duo Family CPU COM Express Module Main Features ® Œ Intel Socket P, Core™ 2 Duo Family Processors Œ Type 2 COM Express Module Support up to 21 Express lanes, 32 bit ® Œ Intel GME965 Chipset PCI Interface, One IDE and Gigabit LAN Œ 2 x DDR2 DIMM Socket Support Un-buffered Non-ECC DDR2 Product Overview ® ® The ICES 300 is a Type 2 COM Express Module featuring Intel GME965 and ICH8M chipset, switch supports Intel Core™ 2 Duo Merom/Core™ 2 Duo Merom LV processors with 667/800 MHz FSB and 2 x DDR2 memories with 533/677 MHz up to 4 GB. The ICES 300 supports 1 x PCI Express x16 for superb graphic display through the carried board; it also supports other display types include LFP, LVDS, and wide screen up to 1920 x 1200. The high performance ICES 300 COM Express Module supports 3 x SATA, 8 x USB 2.0 and 5 x PCIe x1 Lanes through the carried board; and it is compatible with ICEB 8050 carried board. The ICES 300 offers the high processing power and vivid graphic display solution for advanced embedded applications. Specifications CPU Support Œ Drive a standard progressive scan analog monitor with resolution up ® Œ Supports Intel Socket P, Core™ 2 Duo Family Processors to 2048 x 1536 @ 60Hz Œ Supports 800 FSB CPU Œ Supports LFP (local flat panel) LVDS interface resolution up to 1366 x 768 Main Memory Œ Single- or dual-pixel LVDS panel support up to UXGA panel resolution Œ 2 x DIMM, Dual channel DDR2 533/667 MHz up to 4 GB (1600 x 1200) Chipset Œ Supports Single channel for 24 bit/Dual channel for 24 bit ® Œ Intel GME965 Œ Supports UXDA 1600 x 1200 @ 75HZ (4:3) Œ ICH8M I/O Controller Hub Œ Supports WUXDA 1920 x 1200 (Wide Screen) BIOS Audio Œ Award System BIOS Œ HD Audio Interface Œ Plug & Play support COM Express Connectors Œ 8M bits flash ROM Œ AB LAN VGA/LVDS/8 x USB 2.0/HD Audio/3 x SATA/LAN/GPIO/LPC bus/ ® Œ Intel 82573L LAN Chip 2 1 x PCIe x4/1 x PCIe x1/SMBus (I C)/SPI BIOS Œ Supports PXE LAN boot function Œ CD Œ Supports Wake on LAN Œ PCIe x16/IDE/PCI Display System Monitor ® ® Œ Intel GME965 integrated graphics solution w/ Intel Extreme Œ Derived from HW monitor Graphics 2 technology Œ Monitoring of 4 voltages, 2 temperatures and 1 fan Speed Œ Up to 64 MB of dynamic video memory allocation Œ 4 voltage (For +3.3 V, +5 V, +12 V, Vcore) Œ One PCI Express x 16 Lane down to the carried board Œ 2 Temperatures (CPU and one external Temperature Sensor) COM Express COM Express Connector C and D COM Express Connector A and B www.nexcom.com Block Diagram CPU Merom IMVPS 533MHz FSB Channel A R/G/B DDR2 DIMM0 (max:2GB) VGA DDR2 533/667MHz Channel B DDR2 DIMM1 (max:2GB) Crestline Channel A LVDS A/18bit 965GME x16 PEG PCIe x16 Graphics Channel B LVDS B/18bit x4 DMI Controller Link USB 1.1/2.0 PATA 100/66/33 USB 2.0 *8 IDE Bus 33MHz/32bit HD Audio Interface PCI Bus SATA SATA *2 PCIe x1 Giga LAN GPIO/3.3V GPI *4 GPO *4 LPC ICH8 LPC Bus PCIe x1 PCIe x1 PCIe x4 PCIe x4 SMBus SMBus *1 I2C *1 SPI SPI BIOS TYPE 2 TYPE 2 SMBus HW Monitor Power Requirements Ordering Information Œ + 12 V, + 5 VSB, + 3.3 V RTC Œ ICES 300-SKT (PN:10K00030000X0) Dimensions Type 2 COM Express Extended Module GME965 for advanced Œ COM Express Extended Module Type 2 application 155mm (L) x 110mm (W) (6.1" x 4.3") Environment Œ Board Level Operating temperatures: 0°C to 60°C Œ Storage temperatures: -20°C to 80°C Œ Relative humidity: 10% to 90% (operating, non-condensing) 5% to 95% (non-operating, non-condensing) Certifications Œ CE approval Œ FCC Class A COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 01/31/2011