VL-COMm-26 COM Express Mini CPU Module ƒ Extremely small COM Express™ mini form factor ƒ Intel® Atom™ E6x0T processor ƒ Industrial temp. (-40º to +85ºC) ƒ Class 3 manufacturing (optional) ƒ Wide input voltage (8V–17V) ƒ On-board Trusted Platform Module (optional) Highlights Overview The VL-COMm-26 is an extremely small and rugged Computer on Module (COM) based on COM Express Mini Form Factor the industry-standard COM Express mini form factor. Roughly the size of a credit card, the Extremely small 55 mm x 84 mm format with Type 10 pin-out. VL-COMm-26 has been engineered to meet the military and medical industries’ requirements Intel Atom E6x0T Processor for smaller, lighter, and lower power embedded systems while adhering to stringent regulatory 1.6 GHz performance. Low power consumption. standards. The VL-COMm-26 is manufactured to IPC-A-610 Class 2 standards. For extremely- high-reliability applications, IPC-A-610 Class 3 (modified) versions are available. This embedded Industrial Temperature Operation -40° to +85°C operation for harsh environments. computer module, equipped with an Intel Atom E6x0T processor, is designed to withstand extreme temperature, impact, and vibration. Class 3 Manufacturing (optional) For applications where extreme reliability is essential. Details MIL-STD-202G Driven by an Intel Atom E6x0T processor, the VL-COMm-26 provides significant performance Qualified for high shock / vibration environments. and lower power consumption (7W–8W typical) in a very compact package. The VL-COMm-26 Trusted Platform Module (optional) provides compatibility with a broad range of standard x86 application development tools for On-board security option defends against attacks from reduced development time. unauthorized hardware and software. The VL-COMm-26 utilizes advanced Intel technologies to maximize performance. Intel Hyper- Fanless Operation Threading Technology (Intel HT Technology) provides two processing threads per physical No moving parts required for CPU cooling. core which allows applications to work in parallel and complete tasks sooner. Intel Virtualization Wide Input Voltage Range Technology allows one VL-COMm-26 system to function as multiple “virtual” platforms. This Accepts 8 to 17 volts (12V typ.). enables computing activities to be isolated into separate partitions for increased application flexibility and reliability. Enhanced Intel SpeedStep® Technology enables high performance High-performance Video while meeting the power-conservation needs of embedded systems by switching voltage and Graphics core supports MPEG-4 / H.264 and MPEG-2 encoding and decoding. frequency levels in response to processor load. Network The integrated Intel GMA600 graphics core provides hardware-accelerated MPEG-4 / H.264 Gigabit Ethernet (GbE) with remote boot support. and MPEG-2 video encoding and decoding. A standard LVDS output supports flat panel displays. An SDVO output supports a variety of signaling interfaces including VGA and DVI. RAM Up to 2 GB soldered-on DDR2 RAM. The standard Type 10 pin-out provides industry-standard system interfaces including Gigabit Ethernet with network boot capability, seven USB ports, three x1 PCIe lanes, two serial I/O Interfaces interfaces, Intel High-Definition Audio (HDA), LPC, and SMBus to the carrier board. An auxiliary SATA, PCIe, USB host / client, serial, HD audio, LPC, SMBus, board-to-board connector provides two additional serial interfaces and a CAN interface. Dual and CAN. SATA 3 Gb/s interfaces support high-capacity storage. A microSD socket provides flexible Flash Memory solid-state drive (SSD) options. On-board microSD™ socket and SDIO interface for plug-in flash storage. For enhanced security, the VL-COMm-26 supports Execute Disable Bit functionality. This hardware-based security feature reduces exposure to viruses and malicious-code attacks by preventing harmful software from executing and propagating on the network. An optional on-board Trusted Platform Module (TPM) is available for applications that require additional hardware-level security functions. VersaLogic Corporation •  12100 SW Tualatin Rd., Tualatin, OR 97062 •  (503) 747-2261 •  Info@VersaLogic.com •  www.VersaLogic.com VL-COMm-26 COM Express Mini CPU Module Specifications Designed and tested for industrial temperature (-40º to +85ºC) operation, the Form Factor COM Express mini (Type 10): 55 mm x 84 mm (2.17” x 3.31”) rugged VL-COMm-26 also meets MIL-STD-202G specifications for shock General Processor Intel Atom E6x0T platform. 512K 8-way L2 cache. Intel and vibration. Soldered-on RAM provides additional ruggedization for use in Hyper-Threading Technology (HT), Virtualization Technology extremely harsh environments. Heatsink or heat plate versions provide fanless (VT), Enhanced SpeedStep Technology, Thermal Monitoring Technologies, and Execute Disable Bit. heat dissipation. Thermal monitoring technologies protect the system from Chipset Intel EG20T Platform Controller Hub (PCH) thermal failure by reducing power consumption when required to remain within Battery Connection for 3.0V RTC backup battery normal thermal operating limits. Power Requirements Model Idle Typical Max. S3 (@ +12V) § VL-COMm-26EAx 7.2W 7.4W 7.6W 3.0W A wide input voltage range of 8 to 17 volts (12V typ.) simplifies system power supply VL-COMm-26EBx 7.3W 8.0W 8.7W 3.0W requirements. It is fully compatible with 12V automotive-type power systems. VL-COMm-26ECx 7.3W 8.4W 9.5W 3.0W VL-COMm-26EDx 7.3W 8.4W 9.5W 3.0W The VL-COMm-26 is compatible with a variety of popular x86 operating systems Input Voltage 8V–17V (nominal 12V operation) including Windows, Windows Embedded, Linux, and VxWorks. System Reset & Hardware All voltage rails monitored. Watchdog timer with Monitors programmable timeout (1 µS to 10 min.). Product customization is available, even in low quantities. Options include Manufacturing Standards Standard IPC-A-610 Class 2 a Trusted Platform Module, conformal coating, BGA underfill, IPC Class 3 Custom IPC-A-610 Class 3 (modified) (modified) construction, BIOS/splash screen configuration, application-specific Regulatory Compliance RoHS compliant testing, BOM revision locks, special labeling, etc. Operating Temperature -40° to +85°C. Derate -1.1°C per 305m (1,000 ft.) Environmental above 2,300m (7,500 ft.). ¤ As a mate to the VL-COMm-26, VersaLogic can design and manufacture carrier Storage Temperature -40° to +85°C boards that meet your exact requirements for an embedded system. Please Cooling Fanless. Heatsink or bolt-down heat plate. Airflow Requirements Model Temp. Range Airflow contact a VersaLogic Sales Engineer for more information. Heat plate models -40° to +85°C Zero airflow Heat plate must be Ordering Information kept below 90°C Heatsink models -40° to +60°C Zero airflow Model Processor Speed RAM Cooling +60° to +85°C 300 LFM VL-COMm-26EAP* Atom E620T 0.6 GHz 512 MB Heat plate Operating To 15,000 ft. (4,570m) Altitude ¤ VL-COMm-26EBP Atom E640T 1.0 GHz 1 GB Heat plate Storage To 40,000 ft. (12,000m) VL-COMm-26ECP Atom E680T 1.6 GHz 1 GB Heat plate Thermal Shock 5°C/min. over operating temperature VL-COMm-26EDP* Atom E680T 1.6 GHz 2 GB Heat plate Humidity Less than 95%, noncondensing VL-COMm-26EAK* Atom E620T 0.6 GHz 512 MB Heatsink Vibration, Sinusoidal MIL-STD-202G, Method 204, Modified Condition A: 2g VL-COMm-26EBK Atom E640T 1.0 GHz 1 GB Heatsink Sweep ¥ constant acceleration from 5 to 500 Hz, 20 min. per axis VL-COMm-26ECK Atom E680T 1.6 GHz 1 GB Heatsink Vibration, Random ¥ MIL-STD-202G, Method 214A, Condition A: 5.35g rms, VL-COMm-26EDK* Atom E680T 1.6 GHz 2 GB Heatsink 5 min. per axis Mechanical Shock ¥ MIL-STD-202G, Method 213B, Condition G: 20g * Special order half-sine, 11 ms duration per axis TPM (optional) Support for Intel Trusted Platform Module 1.2 devices Security Accessories System RAM Up to 2 GB soldered-on DDR2 SDRAM. 800 MT/s. Memory Part Number Description General Intel GMA600 high-performance graphics core. Video Carrier Boards Advanced 2D / 3D graphics. Hardware-accelerated video encode and decode. VL-BBm-10E-xxxx Carrier board, 5 mm board spacing, AUX connector, Class 2 Solid-State Storage (Flash Memory) VRAM Up to 256 MB + 384 MB shared DRAM VL-F41-xxxx microSD card (SDIO), SLC, industrial temp. Desktop Display Interface π SDVO supports a variety of signaling interfaces including VGA and DVI. Up to 1920 x 1080 (50 Hz) or Hardware 1280 x 1024 (85 Hz). VL-HDW-405 Secondary mounting plate. Simplifies installation in many situations. OEM Flat Panel Interface π Single-channel LVDS interface. 18/24-bit. Up to Attaches to heat plate models. 1280 x 768 (60 Hz). Miscellaneous Rotating Drives / Two SATA 3 Gb/s ports π Mass Storage VL-HDW-401 Thermal compound paste (1.75g) Flash / Solid-State Drives ‡ microSD socket supports up to 32 GB. SDIO interface supports SD, SDIO, and MMC. Ethernet † π One autodetect 10BaseT/100BaseTX/1000BaseT port. Network Interface Network boot option. USB ‡ Six host and one client USB 2.0 ports Type 10 COM 3 / 4 # CMOS levels. 16C550 compatible. 1 Mbps max. I/O Interfaces § Represents operation at +25°C and +12V supply running Windows XP with LVDS display, SATA, GbE, Audio Intel High-Definition Audio (HDA) CODEC COM, and USB keyboard / mouse. Typical power computed as the mean value of Idle and Maximum power PCIe Three x1 PCIe (Gen 1) lanes   specifications. Maximum power measured with 95% CPU utilization. SMBus 1 MHz † IEEE 1588 Precision Time Protocol (PTP) compatible LPC 33 MHz ‡ Bootable storage device Control Wake, reset, and power ¤ Extended altitude specifications available upon request CAN † 2-wire CAN port Auxiliary π Available via Type 10 I/O connector COM 1 # CMOS levels. 16C550 compatible. 1 Mbps max. I/O Interfaces # COM1 and COM2 ports are available only when the auxiliary board-to-board connector is used Handshake lines. ¥ MIL-STD-202G shock and vibe levels are used to illustrate the extreme ruggedness of this product in COM 2 # CMOS levels. 16C550 compatible. 1 Mbps max. general. Testing to higher levels and / or different types of shock or vibration methods can be accommodated   per the specific requirements of the application. Contact a VersaLogic Sales Engineer for further information. BIOS AMI Aptio UEFI BIOS with OEM enhancements. Software Field reprogrammable. Specifications are subject to change without notification. Intel and Atom are trademarks of Intel Corp. Sleep Mode ACPI 3.0. Support for S3 suspend state. COM Express is a trademark of PICMG. PCI Express is a registered trademark of PCI-SIG. microSD is a trademark of SD-3C, LLC. All other trademarks are the property of their respective owners. Operating Systems Compatible with most x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks 02/21/13 VersaLogic Corporation •  12100 SW Tualatin Rd., Tualatin, OR 97062 •  (503) 747-2261 •  Info@VersaLogic.com •  www.VersaLogic.com