TPS850 TOSHIBA Photo IC Silicon Epitaxial Planar TPS850 Mobile Phones, PHS, Pagers Notebook PCs, PDAs Video Cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment The TPS850 is a linear-output photo-IC which incorporates a photodiode and a current amp circuit in a single chip. This photo-IC is current output type, so can set up output voltage freely by arbitrary load resistance. �� High sensitivity: I = 230 µA L @E = 100 lx (typ.) Using the fluorescent light V �� Little fluctuation in light current : Width range = x1 to x1.6 (typ. ±25%) �� Output linearity of illuminance is excellent �� Open-emitter output �� Compact and light surface-mount package �� Pb-free TOSHIBA ― Weight: 0.017 g (typ.) Maximum Ratings (Ta ���� 25°C) Characteristics Symbol Rating Unit Supply voltage V �0.5 to 7 V CC � Output voltage V V V � OUT CC Light current I 10� mA L Permissible power dissipation P 70 mW Operating temperature range T �30 to 85 °C opr Storage temperature range T �40 to 100� °C stg Soldering temperature range (10 s) T 260 °C sol (Note 1) Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions. Recommended Operating Conditions Characteristics Symbol MinTyp.MaxUnit Supply voltage V 2.2 �� 5.5 V CC 1 2002-03-29 TPS850 Electrical and Optical Characteristics (Ta ���� 25°C) Characteristics Symbol Test Condition MinTyp. Max Unit V � 3 V, E ��1000 lx, CC V Supply current I 4 � mA CC � R � 250 � (Note 2) L V � 3 V, E ��100 lx CC V Light current (1) I (1) � 300 � L (Note 2, 4) V � 3 V, E ��10 lx CC V Light current (2) I (2) 18 23 30 �A L (Note 3, 4) V � 3 V, E ��100 lx CC V Light current (3) I (3) 180 230 300 L (Note 3, 4) I (1) L Light current ratio 1.7 � 1.3 I (3) L Dark current I V ��3.3 V, E ��0 � 0.5 �A � LEAK CC V V � 3 V, R � 75 k��� CC L Saturation output voltage Vo 2.2 2.35 V � E ��100 lx (Note 3) V Peak sensitivity wavelength � � � 640 � nm p Rise time t 0.2 1 � r V ��3 V, R � 5 k�, CC L Switching time ms (Note 5) Fall time t 0.35 2 f � Note 2: CIE standard A light source is used (color temperature � 2856K, approximated incandescence light). Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process. Note 4: Light current measurement circuit V CC Light I L source TPS850 OUT A Note 5: Rise time/fall time measurement method I F Pulse drive V CC White LED 1.5 V TPS850 OUT 90% R L V OUT 10% GND t t r f 2 2002-03-29 TPS850 Package Dimensions Weight: 0.017 g (typ.) Block Diagram 3 V CC Current amp 4 OUT 1 GND 2 GND 3 2002-03-29 TPS850 Handling Precautions At power-on in darkness, the internal circuit takes about 50 ms to stabilize. During this period the output signal is unstable and may change. Please take this into account. Moisture-Proof Packing (1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. (2) Since the optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture and they should therefore be stored under the following conditions: Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (3) Baking is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h. These devices are packed on tapes; hence, please avoid baking at high temperature. Recommended baking conditions: 60°C for 12 h or longer Mounting Precautions (1) Do not apply stress to the resin at high temperature. (2) The resin part is easily scratched, so avoid friction with hard materials. (3) When installing the assembly board in equipment, ensure that this product does not come into contact with other components. Mounting Methods (1) Reflow soldering �� Package surface temperature: 260°C (max) �� Please perform reflow soldering using the following reference temperature profile. Perform reflow soldering no more than twice. 260°C max 230°C 190°C 180°C Preheating part 60 s to 120 s 30 s to 50 s Heating part Time (s) � �� Please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile. �� Second reflow soldering In case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. Storage conditions before second reflow soldering: 30°C, 60% RH or lower �� Do not perform flow soldering. �� Make any necessary soldering correction manually. (do not do this more than once for any given pin.) Temperature: no more than 350°C (25 W for soldering iron) Time: within 5 s 4 2002-03-29 Temperature (°C) � TPS850 (2) Recommended soldering pattern 1.6 1. 1.3 6 Unit: mm (3) Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50°C � 30 s or : 30°C � 3 mins Ultrasonic cleaning: 300 W or less Packing Specification (1) Packing quantity Reel (minimum packing quantity) 3000 devices Carton 5 reels (15000 devices) (2) Packing format An aluminum envelope containing silica gel and reels is deaerated and sealed. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. �� Carton specification Label Carton dimensions (W) 81 mm � (L) 280 mm � (H) 280 mm 5 2002-03-29 0.95 0.6 0.95 TPS850 Tape Packing Specifications (1) Reel dimensions 11.4 � 1 � 0� �180 9 � 0.3 � 4 �21 � 0.3 �13 � 0.5 2 � 0.5 Label (2) Tape dimensions 4.0 � 0.1 � 0.1� A �1.5 0.2 � 0.05 0 2.0 � 0.05 BB’ 4.0 � 0.1 1.3 � 0.1 Device Orientation A’ A-A’ 2.8 � 0.1 Feed direction max 6� max 6� B-B’ (3) Packing quantity: 3000/reel 6 2002-03-29 �60 (2.75) 3.5 � 0.1 1.75 � 0.1 8.0 � 0.2 3.6 � 0.1 max 6� max 6� TPS850 P – Ta I – Ta (typ.) LEAK 10 80 V � 3 V CC Please refer to Figure 2. 70 1 60 50 0.1 40 30 0.01 20 10 0.001 0 0 20 40 60 80 100 20 40 60 80 100 Ambient temperature Ta (°C) Ambient temperature Ta (°C) I – E (typ.) Relative I – Ta (typ.) L V L 10000 1.4 V � 3 V CC Please refer to Figure 1. Fluorescent light A light source 1000 1.2 100 1.0 Ta � 25°C 10 0.8 V � 3 V CC Please refer to Figure 1. A light source Fluorescent light 1 0.6 1 10 100 1000 10000 �40 �20 0 20 40 60 80 100 Illuminance E (lx) Ambient temperature Ta (°C) V Relative I – V (typ.) Vo – E (typ.) L CC V 10 1.6 Ta � 25°C V � 3 V CC Please refer to Figure 4. 1 1.2 0.1 0.8 0.01 0.4 Fluorescent light R � 250 � 0.001 L Fluorescent light R � 5 k� L A light source R � 250 � L Ta � 25°C A light source R � 5 k� L Please refer to Figure 1. 0.0001 0 2 1 10 100 1000 10000 3 4 5 6 7 Supply voltage V (V) Illuminance E (lx) CC V 7 2002-03-29 Relative light current Light current����I (�A) Power dissipation P (mW) L Output voltage Vo (V) Relative light current Dark current I (�A) LEAK TPS850 I – E (typ.) Relative I – Ta (typ.) CC V CC 10 1.40 V � 3 V CC Using the Fluorescent light 3 R = 1 k� L Please refer to Figure 3. 1 1.20 0.3 0.1 1.00 0.03 Ta � 25°C V � 3 V CC 0.01 Using the A light source 0.80 Please refer to Figure 3. R � 250 � L 0.003 R � 1000 � L R � 5000 � L 0.001 0.60 1 10 100 1000 10000 �40 �20 0 20 40 60 80 100 Illuminance E (lx) Ambient temperature Ta (°C) V Switching characteristics Switching characteristics (Non-saturating operation) (typ.) (Saturating operation) (typ.) 1000 1000 Ta � 25°C Ta � 25°C V � 3 V V � 3 V CC CC � V � 1.5 V V � 2 V OUT OUT Using the White LED Using the White LED Please refer to Figure 5. Please refer to Figure 5. 300 300 100 100 t f t f 30 30 t d t d t t r s 10 10 t r 3 3 1 1 t s 0.3 0.3 0.1 0.1 0.1 0.3 1 3 10 0.1 10 0.3 1 3 Load resistance R (k�) Load resistance R (k�) L L 8 2002-03-29 Switching time (�s) Consumption current I (mA) CC Switching time (�s) Relative consumption current TPS850 Radiation pattern (typ.) Spectral response (typ.) 1 Ta � 25°C Ta � 25°C 0.8 Luminosity angle 0� 10� 10� 0.6 20� 20� 30� 30� 40� 40� 50� 0.4 50� 60� 60� 70� 70� 0.2 80� 80� 0 90� 90° 200 400 600 800 1000 1200 0 0.2 0.4 0.6 0.8 1.0 Relative sensitivity Wavelength � (nm) Measurement Circuits V V CC CC I LEAK Light IL OUT OUT TPS850 TPS850 A A Figure 1 Light current measurement circuit Figure 2 Dark current measurement circuit Icc V CC A V CC Light Light OUT TPS850 TPS850 V Vo R R L L Figure 3 Consumption current measurement circuit Figure 4 Output voltage measurement circuit I F t t d s Pulse drive V CC 1.5 V 90% White LED OUT TPS850 V OUT R L 10% GND t t r f Figure 5 Switching measurement circuit and waveform 9 2002-03-29 Relative sensitivity TPS850 RESTRICTIONS ON PRODUCT USE 000707EBA �� TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. �� The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. �� The products described in this document are subject to the foreign exchange and foreign trade laws. �� The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. �� The information contained herein is subject to change without notice. 10 2002-03-29