uDiskOnChip (uDOC) Modular Flash Disk with USB 2.0 Interface Data Sheet, November 2006 Highlights The performance of embedded systems in markets such as Single Board Computers (SBCs), thin clients, consumer electronics, Point Of Sale (POS) and telecom, is limited by IDE-based flash disks. A combination of higher Performance capacity, higher performance devices is needed Number of USB 2.0 High-Speed Flash Chips to support larger OSs, heavier GUI applications, a wide variety of installed applications and Sustained Read 2 20 MByte/sec local data storage. uDiskOnChip (uDOC) Sustained Write 2 10 MByte/sec answers these needs by merging M-Systems’ Sustained Read 1 13 MByte/sec expertise in three worlds: the USB 2.0 high- Sustained Write 1 7 MByte/sec speed interface, the DiskOnChip industry- standard flash for embedded systems, and the „ USB 2.0: 480 Mbit/sec high-speed USB ™ SuperMAP cryptographic engine. compatible „ USB 1.1 uDiskOnChip features: † 12 Mbit/sec full-speed USB compatible „ Exceptional read, write, and erase † Sustained Read rate: 1 MB/sec performance † Sustained Write rate: 0.85 MB/sec ® „ Built-in proprietary TrueFFS technology „ Flash Interleave and Fly-By™ algorithm for for full hard-disk emulation, high data improved performance reliability, and maximum flash lifetime Data Reliability „ Data integrity with Error Detection „ 4-bit Error Detection Code/Error Correction Code/Error Correction Code (EDC/ECC) Code (EDC/ECC), based on a patented based on a combination of BCH and combination of BCH and Hamming code Hamming algorithms algorithms „ Support for major embedded OSs, including „ Guaranteed data integrity even after power Windows XP Embedded and Linux loss Protection and Security Features „ Transparent bad-block management „ SuperMAP cryptographic engine to enable „ Dynamic and static wear-leveling protected partitions „ Wear leveling algorithm that provides more „ Data protected in hardware with digital than 5 million write/erase cycles for reliable signature: RSA with 64-byte key data storage over an extended period 1 Data Sheet, Rev. 2.3 94-SR-003-01-8L Operating Environment RoHS Support „ Any BIOS supporting boot from USB Mass „ RoHS version available (all configurations) Storage Class devices Environmental „ Can be used for boot and/or storage on the „ Operating temperature: following operating systems: † Commercial: 0ºC to +70ºC † Windows XP Embedded † Extended: -40ºC to +85ºC † Windows CE „ Storage temperature: -55ºC to +95ºC † Windows Embedded for Point of Service (WEPOS) Capacities † Linux „ 32MB – 4GB † VxWorks (storage only) Applications Power Requirements „ Embedded systems „ Power supply: 5VDC±10% „ Single-board computers, Extended PCs „ Power consumption (Vcc=5V): „ Thin clients, network computers † Read/Write: 100 mA (typ) „ Set-top boxes † Suspend: <500 µA „ Medical equipment Form Factors „ Gaming „ Horizontal alignment with mounting hole „ Horizontal alignment with 1x5 mechanical connector „ Low profile with mounting hole 2 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L TABLE OF CONTENTS 1. Introduction ...............................................................................................................................5 2. Product Overview...................................................................................................................... 6 2.1 Product Description ............................................................................................................ 6 2.2 2x5 Electrical Interface ....................................................................................................... 7 2.2.1 Standard On-Board USB Header......................................................................................... 7 2.2.2 uDiskOnChip Connector....................................................................................................... 7 3. Theory of Operation .................................................................................................................. 8 3.1 Block Diagram .................................................................................................................... 8 3.2 System Architecture ........................................................................................................... 9 3.2.1 Controller Internal Components ........................................................................................... 9 3.2.2 Controller External Components .......................................................................................... 9 4. TrueFFS Technology............................................................................................................... 10 4.1 Overview........................................................................................................................... 10 4.2 Bad-Block Management ................................................................................................... 10 4.3 Wear-Leveling .................................................................................................................. 11 4.4 Power Failure Management ............................................................................................. 11 4.5 Error Detection/Correction................................................................................................ 12 5. Specifications .......................................................................................................................... 13 5.1 Standards Compliance ..................................................................................................... 13 5.2 Environmental................................................................................................................... 13 5.2.1 Temperature....................................................................................................................... 13 5.2.2 Electrostatic Discharge (ESD)............................................................................................ 13 5.2.3 Shock and Vibration ........................................................................................................... 13 5.2.4 Mean Time Between Failures (MTBF) ............................................................................... 13 5.3 Mechanical ....................................................................................................................... 14 5.3.1 Horizontal - Single Connector ............................................................................................ 14 5.3.2 Horizontal - Dual Connector............................................................................................... 15 5.3.3 Low Profile - Single Connector........................................................................................... 16 5.3.4 LED Functionality ............................................................................................................... 16 5.3.5 Dimensions......................................................................................................................... 16 5.3.6 uDiskOnChip-to-USB Adapter............................................................................................ 18 5.4 Product Markings.............................................................................................................. 18 5.5 Electrical Specifications.................................................................................................... 19 5.5.1 Absolute Maximum Ratings................................................................................................ 19 5.5.2 DC Characteristics ............................................................................................................. 19 3 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 6. Software Description .............................................................................................................. 21 6.1 Boot and Storage.............................................................................................................. 21 6.2 Secure Boot and Storage ................................................................................................. 21 7. Ordering Information............................................................................................................... 22 7.1 uDiskOnChip .................................................................................................................... 22 7.2 uDiskOnChip-to-USB Adapter.......................................................................................... 24 How to Contact Us ........................................................................................................................ 25 4 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 1. INTRODUCTION This data sheet includes the following sections: Section 1: Overview of data sheet contents Section 2: Product overview, including brief product description, interface diagram and header/connector descriptions Section 3: Theory of operation for the major building blocks Section 4: Description of TrueFFS technology Section 5: Environmental, mechanical and electrical specifications Section 6: Description of the available software components Section 7: Ordering information for uDiskOnChip For additional information on M-Systems’ flash disk products, please contact one of the offices listed on the back page. 5 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 2. PRODUCT OVERVIEW 2.1 Product Description uDiskOnChip (uDOC) is the ideal data storage device in any USB-capable system, capitalizing on M-Systems’ expertise in three fields: The USB interface (based on its USB flash drive), flash drives for the embedded market (based on the DiskOnChip product line), and security (based on patented algorithms). uDiskOnChip offers the speed and ease of the USB interface. uDiskOnChip can work with any operating system that supports USB Mass Storage Class devices, such as Windows XP Embedded, Windows CE, Linux, and others. M-Systems’ patented TrueFFS flash management technology, which fully emulates a hard disk in DiskOnChip products, is embedded in the uDiskOnChip firmware to streamline integration efforts. This transparent file system management enables read/write operations that are identical to a standard, sector-based hard disk. In addition, TrueFFS employs patented methods, such as virtual mapping, dynamic and static wear-leveling, and automatic block management to ensure high data reliability and to maximize flash life expectancy. Data integrity is guaranteed through an embedded 4-bit error detection and error correction code algorithm that automatically detects and corrects data errors. The EDC/ECC algorithm is based on a combination of Hamming and BCH code. uDiskOnChip provides data protection in hardware, utilizing RSA with a 64-byte key. This feature is enabled by the SuperMAP cryptographic engine developed by M-Systems’ Fortress division and used successfully in thousands of smartcards. uDiskOnChip is based on Single Level Cell (SLC) NAND flash technology. This technology is superior in its data storage characteristics, featuring the industry’s highest performance. Additionally, NAND flash technology is known for its high density and small die size, with the related cost and real estate benefits. Multi-Level Cell (MLC) NAND is planned for use in the next-generation product, enabling further cost benefits. uDiskOnChip is available in capacities ranging from 32MB to 4GB with a fast and simple upgrade path. It fits easily into any platform with an embedded USB connector, and can be secured firmly into place for enhanced ruggedness. 6 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 2.2 2x5 Electrical Interface uDiskOnChip is available in a horizontal version with a 2x5-pin electrical interface. uDiskOnChip provides two configurations; a 2x5 electrical interface plus mounting hole, and a 2x5 electrical interface plus 1x5 mechanical interface. 2.2.1 Standard On-Board USB Header Table 1 lists the host interface on-board header pins and signals. Table 1: Host Interface 2x5 On-Board Header Pin Signal Pin Signal 1 +5VDC 2 +5VDC 3 USB1 Data(-) 4 USB2 Data(-) 5 USB1 Data(+) 6 USB2 Data(+) 7 GND 8 GND NC (future option in the Low Profile 9 Key (no pin) 10 configuration: Write Protection signal) 2.2.2 uDiskOnChip Connector Figure 1 illustrates the uDiskOnChip 2x5 device interface connector. Figure 1: uDiskOnChip 2x5 Connector Pinout 7 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 3. THEORY OF OPERATION 3.1 Block Diagram The uDiskOnChip controller enables the highest performance for USB 2.0, coupled with the best security and reliability available. The controller’s firmware inherently supports multi-vendor flash components to provide flexibility and guarantee delivery to our customers. As with other products based on M-Systems’ technology, the uDiskOnChip controller contains M-Systems’ patented USB device interface, which is compatible with USB 2.0. The controller also has a high-speed 32-bit RISC microcontroller with Idle and Deep Power-Down modes for power management. The uDiskOnChip controller architecture is illustrated in Figure 2. LEDs Xtal Clock GPIO Mechanism ARM-7TDMI Timers and 32-bit Counters RISC CPU USB M-Systems USB Connector Controller NAND Flash Flash Controller Crypto-Core SRAM Voltage Reset ROM Regulator Mechanism uDiskOnChip Controller Figure 2: uDiskOnChip Controller Block Diagram 8 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L USB Protocol Multi-Layer Bus 3.2 System Architecture 3.2.1 Controller Internal Components • ARM7TDMI CPU, which serves as the hardware infrastructure for the M-Systems flash controller algorithm. • M-Systems Flash Controller, the heart of the system, which is responsible for the flash-handling algorithm, flash timing, and Error Detection and Correction. • USB (PHY and Digital) Controller, embedded in the uDiskOnChip controller, which interfaces with all external interactions via an external USB connector. • Crypto-Core, the hardware engine that provides security functions and services to be used by the controller. • SRAM, for running the controller program faster and more efficiently. • ROM, for running the boot code and additional service program. • Clock Mechanism, which drives all clock sources, some from the crystal oscillator and others from the PHY PLL. • Reset Mechanism, which restores the reset states of the system, and forces the controller to perform the boot procedure. The Reset state causes all cores to move to Reset mode. • Timers and Counters, including the device timer, watchdog, and general-purpose timer/counter channels. 3.2.2 Controller External Components • NAND Flash for data storage. • Crystal Oscillator 12.000 MHz, the main clock source. • 3.3V Voltage Regulator to supply a stable power supply to the circuit and for accurate and reliable operation. • LEDs for indicating controller activity. 9 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 4. TRUEFFS TECHNOLOGY 4.1 Overview M-Systems’ patented TrueFFS technology was designed to maximize the benefits of flash memory while overcoming inherent flash limitations that would otherwise reduce its performance, reliability, and lifetime. TrueFFS emulates a hard disk, making flash management completely transparent to the OS. TrueFFS, which has become an industry standard for reliability, is implemented in uDiskOnChip, therefore no integration is required. Application OS File System TrueFFS uDiskOnChip Figure 3: TrueFFS Implemented in uDiskOnChip Firmware TrueFFS technology features: • Flash file system management • Bad-block management • Dynamic virtual mapping • Dynamic and static wear-leveling • Power failure management • Implementation of MLC-tailored EDC/ECC • Performance optimization 4.2 Bad-Block Management Since NAND flash is an imperfect storage media, it can contain bad blocks that cannot be used for storage because of their high error rates. TrueFFS automatically detects and maps out bad blocks upon system initialization, ensuring that they are not used for storage. This management process is completely transparent to the user, who is unaware of the existence and location of bad blocks, while remaining confident of the integrity of data stored. 10 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 4.3 Wear-Leveling Flash memory can be erased a limited number of times. This number is called the erase cycle limit, or write endurance limit, and is defined by the flash array vendor. The erase cycle limit applies to each individual erase block in the flash device. In uDiskOnChip, the erase cycle limit of the flash is 100,000 erase cycles. This means that after approximately 100,000 erase cycles, the erase block begins to generate storage errors at a rate significantly higher than the error rate that is typical to the flash. In a typical application, and especially if a file system is used, specific pages are constantly updated (e.g., the page/s that contain the FAT, registry, etc.). Without any special handling, these pages would wear out more rapidly than other pages, reducing the lifetime of the entire flash. To overcome this inherent deficiency, TrueFFS uses M-Systems’ patented wear-leveling algorithm. This wear-leveling algorithm ensures that consecutive writes of a specific sector are not written physically to the same page in the flash. This spreads flash media usage evenly across all pages, thereby maximizing flash lifetime. M-Systems’ wear-leveling mechanism provides more than 5 million write/erase cycles for reliable data storage over an extended period. Dynamic Wear-Leveling TrueFFS uses statistical allocation to perform dynamic wear-leveling on newly written data. This minimizes the number of erase cycles per block. As a block erase is the most time-consuming operation, dynamic wear-leveling has a major impact on overall performance. This impact cannot be noticed during the first write to flash (since there is no need to erase blocks beforehand), but becomes more and more noticeable as the flash media becomes full. Static Wear-Leveling Areas on the flash media may contain static files, characterized by blocks of data that remain unchanged for very long periods of time, or even for the whole device lifetime. If wear-leveling were only applied on newly written pages, static areas would never be cycled. This limited application of wear-leveling would lower life expectancy significantly in cases where flash memory contains large static areas. To overcome this problem, TrueFFS forces data transfer in static areas as well as in dynamic areas, thereby applying wear-leveling to the entire media. 4.4 Power Failure Management TrueFFS uses algorithms based on erase after write instead of erase before write to ensure data integrity during normal operation and in the event of a power failure. Used areas are reclaimed for erasing and writing the flash management information into them only after an operation is complete. This procedure serves as a check on data integrity. The erase-after-write algorithm is also used to update and store mapping information on the flash memory. This keeps the mapping information coherent even during power failures. The only mapping information held in RAM is a table pointing to the location of the actual mapping information. This table is reconstructed during power-up or after reset from the information stored in the flash memory. 11 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L To prevent data from being lost or corrupted, TrueFFS uses the following mechanisms: • When writing, copying, or erasing the flash device, the data format remains valid at all intermediate stages. Previous data is never erased until the operation has been completed and the new data has been verified. • A data sector cannot exist in a partially written state. The operation is either successfully completed, in which case the new sector contents are valid, or the operation has not yet been completed or has failed, in which case the old sector contents remain valid. 4.5 Error Detection/Correction TrueFFS implements a unique MLC-tailored Error Correction Code (ECC) algorithm to ensure data reliability. The advanced algorithm provides 4-bit Error Detection Code/Error Correction Code (EDC/ECC), based on a patented combination of BCH and Hamming code algorithms. 12 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 5. SPECIFICATIONS 5.1 Standards Compliance uDiskOnChip complies with CE requirements and FCC standards, and has been approved by the UL organization. uDiskOnChip is also available in lead-free versions (all configurations), which comply with the RoHS directive. 5.2 Environmental 5.2.1 Temperature Operating Commercial: 0ºC to +70ºC Extended: -40ºC to +85ºC Storage Extended: -55ºC to +95ºC 5.2.2 Electrostatic Discharge (ESD) uDiskOnChip has been tested and approved for immunity from ESD under the conditions described in Table 2. Table 2: ESD Ratings for uDiskOnChip ESD Type Maximum Discharge (KV) Contact 1, 2, 4 Air 2, 4, 6, 8 5.2.3 Shock and Vibration Table 3: Shock/Vibration Testing for uDiskOnChip Reliability Test Test Conditions Reference Standards Vibration 10 Hz to 500 Hz, 5 g, 3 axes, 30 minutes IEC 68-2-6 Mechanical Shock Duration: 11 ms, 50 g, 3 axes, 18 times IEC 68-2-27 5.2.4 Mean Time Between Failures (MTBF) The reliability figure of merit most often used for electronic equipment is Mean Time Between Failures (MTBF). M-Systems estimates MTBF using a prediction methodology based on reliability data for the individual components in M-Systems products. Component data comes from several sources: device life tests, failure analysis of earlier equipment, device physics, and field returns. M-Systems uses following methods to predict reliability: • Telcordia Special Report SR-332, Reliability Prediction Procedure for Electronic Equipment (RPP). 13 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L • British Telecom Industry HRD5, Handbook of Reliability Data for Electronic Components used in Telecommunication System. Table 4 summarizes the MTBF prediction results for various uDiskOnChip configurations. The analysis was performed using a RAM Commander™ failure rate prediction. • Failure Rate: The total number of failures within an item population, divided by the total number of life units expended by that population, during a particular measurement interval under stated condition. • Mean Time Between Failures (MTBF): A basic measure of reliability for repairable items: The mean number of life units during which all parts of the item perform within their specified limits, during a particular measurement interval under stated conditions. Table 4: uDiskOnChip MTBF Failure Rate per Product Condition MTBF (Hours) Million Hours 64/128MB Telcordia SR-332, GB, 25°C 4,667,755 0.214 256/512/1024/2048MB Telcordia SR-332, GB, 25°C 4,130,674 0.24 64/128MB Telcordia SR-332, GF, 35°C 1,667,189 0.599 256/512/1024/2048MB Telcordia SR-332, GF, 35°C 1,360,977 0.735 5.3 Mechanical uDiskOnChip is offered in a horizontal version with two available configurations and in a Low Profile version, as described below. In addition, an adapter is available (described in Section 5.3.6) to enable customers to evaluate uDiskOnChip using an external USB port. 5.3.1 Horizontal - Single Connector In the single connector configuration, uDiskOnChip has a single 2x5 electrical connector plus a mounting hole, as shown in Figure 4. Figure 4: uDiskOnChip Horizontal Version with Single Connector 14 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 5.3.2 Horizontal - Dual Connector In the dual connector configuration, uDiskOnChip has a 2x5 electrical connector, along with a 1x5 mechanical connector for mounting stability, as shown in Figure 5. Figure 5: uDiskOnChip Horizontal Version with Dual Connector Configuration 15 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 5.3.3 Low Profile - Single Connector In the low profile single connector configuration, uDiskOnChip has a single low-profile 2x5 electrical connector plus a mounting hole. (Side View) (Bottom View) (Top View) Figure 6: uDiskOnChip Horizontal Version with Single Connector 5.3.4 LED Functionality • LED flashing slowly: uDiskOnChip is connected and inactive • LED flashing rapidly: uDiskOnChip is transmitting/receiving data or is engaged in the identification process • Default LED colors: o Red: USB high-speed mode (10 MB/sec write, 20 MB/sec read) o Green: USB full-speed mode (0.85 MB/sec write, 1 MB/sec read) 5.3.5 Dimensions uDiskOnChip mechanical dimensions are in mm, with a general tolerance of ±0.25 mm. Horizontal Configuration Figure 7: uDiskOnChip 2x5 Horizontal Version, Single/Dual Connector, Top View 16 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L Figure 8: uDiskOnChip 2x5 Horizontal Version, Single/Dual Connector, Bottom View Low Profile Configuration Figure 9: uDiskOnChip 2x5 Low Profile Version 17 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 5.3.6 uDiskOnChip-to-USB Adapter An adapter is available to assist customers in evaluating uDiskOnChip. The adapter enables inserting uDiskOnChip in an external desktop or laptop USB port. Figure 10: uDiskOnChip External USB Adapter, with and without Mounted Device 5.4 Product Markings uDiskOnChip has two labels, one showing the part number and ordering information (Figure 11) and another showing the standards for which uDiskOnChip is certified (Figure 12). Figure 11: uDiskOnChip Part Number and Ordering Information Label Table 5 explains the part number and ordering information printed on the uDiskOnChip label. Table 5: Marking Specifications Label Item Description P/N Unit part number Ordering Info Unit ordering information S/N:YWWLLMNNNNN Unit serial number VERZ – X.XXX Z – Bill Of Material (BOM) revision X.XXX – Firmware version Figure 12: uDiskOnChip Standards Label 18 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 5.5 Electrical Specifications 5.5.1 Absolute Maximum Ratings Table 6: Absolute Maximum Ratings Parameter Symbol Min Max Unit Ambient Operating Temperature Range (Commercial) T 0 70 °C A Ambient Operating Temperature Range (Extended) T -40 85 °C A Power Supply Voltage Relative to Ground V 4 6 V bus Voltage level on D+ / D- Relative to Ground 3 V -1 4.6 V data 5.5.2 DC Characteristics Table 7: DC Characteristics for Full-Speed Operation (T = 25°C,V = 3.3v, V = 0V) A DD SS Parameter Symbol Test Conditions Min Typ Max Unit USB Signals Supply Voltage: V 4.40 5.00 5.25 V BUS Supply Current (RMS): -- VBUS=5.0v Operating Icc -- 87 100 mA Suspend Iccs <500 <500 µA Max Current Consumption (Peak Value) 105 mA Input Levels USB Signals (D+, D-): Low V -- -- -- 0.8 V IL High V -- 2.0 -- -- V IH Output Voltage USB Signals (D+, D-): Low V R of 1.5 kΩ to 3.6V 0 -- 0.4 V OL L High V R of 15 kΩ to GND 2.6 -- 3.6 V OH L Output Signal Crossover Voltage USB Signals (D+, D-) V 1.3 2.0 V CRS 19 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L Table 8: DC Characteristics for High-Speed Operation (T = 25°C,V = 3.3v, V = 0V) A DD SS Parameter Symbol Test Conditions Min Typ Max Unit USB Signals Supply Voltage: VBUS 4.40 5.00 5.25 V Supply Current (RMS) -- VBUS=5.0v Operating Icc -- 100 120 mA Suspend Iccs <500 <500 µA Max Current Consumption (Peak Value) 150 mA Input Levels USB Signals (D+, D-): -- Low VIL -- -- 0.8 V High VIH -- 2.0 -- -- V Output Voltage USB Signals (D+, D-): Low VOL R of 1.5 kΩ to 3.6V 0 -- 0.4 V L High VOH R of 15 kΩ to GND 2.6 -- 3.6 V L Output Signal Crossover Voltage USB Signals (D+, D-): VCRS 1.3 2.0 V 20 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 6. SOFTWARE DESCRIPTION 6.1 Boot and Storage uDiskOnChip is supported under the embedded operating systems listed in Table 9. In the standard boot and storage modes, uDiskOnChip is recognized as a hard drive in the system. The system can also boot from uDiskOnChip, eliminating the need for additional components. Software packages for the supported operating systems can be downloaded from the M-Systems website, along with the relevant documentation. Table 9: Supported Operating Systems Operating System Version Application Note AP-DOC-1304, Booting Windows XP Embedded Windows XP Embedded Service Pack 2 from uDiskOnChip Windows Embedded for Point of AP-EMB-0305, Creating a WEPOS Image with N/A Service (WEPOS) Support for USB Mass Storage Devices AP-EMB-0105, Creating a Windows CE Image Windows CE 4.2 and 5.0 with Support for USB Mass Storage Devices AP-DOC-0105, Booting Trustix/Fedora (Kernel Linux All versions 2.4.XX/2.6XX) from uDiskOnChip AP-EMB-0205, Creating a VxWorks Image with VxWorks 5.x and 6.1 Support for USB Mass Storage Devices 6.2 Secure Boot and Storage Secure Boot is supported by Microsoft Windows XP Embedded only. Secure Boot mode provides uDiskOnChip customers with the advantage of M-Systems’ security capabilities, which implement unparalleled security algorithms in hardware using SuperMAP technology. M-Systems’ security technology is supported by over 15 patents, and field tested in tens of millions of smartcards. Some customization may be required to set uDiskOnChip and the host to work in Secure Boot mode. M-Systems’ technical support department can provide a software package, including all required user manuals, for use in configuring uDiskOnChip to function as a secure system boot device. In Secure Boot mode, uDiskOnChip can be partitioned into up to six drives, with a maximum of two secure drives and four standard drives. The secure drives are write protected using Public Key Infrastructure (PKI) for key exchange and authentication (implemented by an RSA 64-byte key). In addition, uDiskOnChip supports the Enhanced Write Filter (enabling Microsoft EWF). It is recommended to partition uDiskOnChip as follows when using Secure Boot mode: • Secure partition I: This drive stores the Windows XP Embedded operating system image. • Secure partition II (optional): This drive can function as a secure storage area for data that should not be accessed by unauthorized users • Standard partition: Up to four standard drives that are not write protected 21 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L 7. ORDERING INFORMATION 7.1 uDiskOnChip M M Me e ech ch chani ani anic c ca a alll S S Su u up p pp p por or ort t t En En Env v viiiro ro ronm nm nme e en n nta ta talll R R Ro o oH H HS S S Su Su Suppo ppo ppor r rt t t Blank Blank Blank: Mo : Mo : Mounti unti untin n ng g g ho ho hollle e e Bla Bla Blan n nk: C k: C k: Co o om m mm m me e ercial rcial rcial Bla Bla Blan n nk: S k: S k: Sttta a an n nd d da a ar r rd d d J: 1 J: 1 J: 1x x x5 m 5 m 5 me e ech ch chanic anic anica a al l l c c co o onn nn nnec ec ector tor tor X: Exte X: Exte X: Exten n nd d de e ed d d P: L P: L P: Le e ea a ad d d f f fr r re e ee e e MD16x5 MD16x5- -Dxxxx- Dxxxx-1F-J- 1F-J-T- T-P P D D De e ev v viiice C ce C ce Co o ode de de De De Den n ns s si i it t ty y y F F Fllla a as s sh h h Co Co Conf nf nfiiig g gur ur ura a at t tiiio o on n n 16 16 166 6 65 5 5: u : u : uD D Dis is iskO kO kOnCh nCh nChiiip p p Ho Ho Horiz riz rizont ont ontal al al D: D: D: M M MB B By y ytttes es es Blan Blan Blank: T k: T k: Tw w wo o o fl fl flas as ash c h c h ch h hiiip p ps ( s ( s (256 256 256MB MB MB and and and ab ab abo o ov v ve) e) e) 16 16 167 7 75 5 5: u : u : uD D Dis is iskO kO kOnCh nCh nChiiip p p Lo Lo Low w w Pr Pr Profi ofi ofillle e e xx xx xxxx: V xx: V xx: Va a alllu u ue e e F: O F: O F: On n ne e e ffflllas as ash ch h ch h chiiip p p ( ( (3 3 32 2 2- - -5 5 51 1 12 2 2M M MB B B) ) ) Figure 13: Ordering Information Structure Table 10: uDiskOnChip Form Factors and Ordering Information Capacity Configuration Temperature Range Ordering Information (MB) 32 MD1665-D32-P 64 MD1665-D64-P 128 MD1665-D128-P 256 MD1665-D256-P Commercial 512 MD1665-D512-P 1024 MD1665-D1024-P 2048 MD1665-D2048-P Horizontal with single connector 4096 MD1665-D4096-P and mounting hole (PB Free 32 MD1665-D32-X-P Version) 64 MD1665-D64-X-P 128 MD1665-D128-X-P 256 MD1665-D256-X-P Extended 512 MD1665-D512-X-P 1024 MD1665-D1024-X-P 2048 MD1665-D2048-X-P 4096 MD1665-D4096-X-P 256 MD1665-D256-1F-P Single-flash horizontal configuration with single 512 MD1665-D512-1F-P Commercial connector and mounting hole 1024 MD1665-D1024-1F-P (PB-free version) 2048 MD1665-D2048-1F-P 256 MD1665-D256-1F-X-P Extended 22 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L Capacity Configuration Temperature Range Ordering Information (MB) 512 MD1665-D512-1F-X-P 1024 MD1665-D1024-1F-X-P 2048 MD1665-D2048-1F-X-P 32 MD1665-D32-J-P 64 MD1665-D64-J-P 128 MD1665-D128-J-P 256 MD1665-D256-J-P Commercial 512 MD1665-D512-J-P 1024 MD1665-D1024-J-P 2048 MD1665-D2048-J-P 4096 MD1665-D4096-J-P Horizontal configuration with dual connector (PB-free version) 32 MD1665-D32-J-X-P 64 MD1665-D64-J-X-P 128 MD1665-D128-J-X-P 256 MD1665-D256-J-X-P Extended 512 MD1665-D512-J-X-P 1024 MD1665-D1024-J-X-P 2048 MD1665-D2048-J-X-P 4096 MD1665-D4096-J-X-P 256 MD1665-D256-1F-J-P 512 MD1665-D512-1F-J-P Commercial 1024 MD1665-D1024-1F-J-P Single-flash horizontal 2048 MD1665-D2048-1F-J-P configuration with dual connector 256 MD1665-D256-1F-J-X-P (PB-free version) 512 MD1665-D512-1F-J-X-P Extended 1024 MD1665-D1024-1F-J-X-P 2048 MD1665-D2048-1F-J-X-P 32 MD1675-D32-P Low Profile configuration with single connector and mounting 64 MD1675-D64-P hole (PB-free version) 128 MD1675-D128-P 256 MD1675-D256-P Commercial 512 MD1675-D512-P 1024 MD1675-D1024-P 2048 MD1675-D2048-P 4096 MD1675-D4096-P 32 MD1675-D32-X-P Extended 64 MD1675-D64-X-P 128 MD1675-D128-X-P 256 MD1675-D256-X-P 512 MD1675-D512-X-P 1024 MD1675-D1024-X-P 23 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L Capacity Configuration Temperature Range Ordering Information (MB) 2048 MD1675-D2048-X-P 4096 MD1675-D4096-X-P 256 MD1675-D256-1F-P 512 MD1675-D512-1F-P Commercial 1024 MD1675-D1024-1F-P 2048 MD1675-D2048-1F-P Single-flash low profile configuration (PB-free version) 256 MD1675-D256-1F-X-P 512 MD1675-D512-1F-X-P Extended 1024 MD1675-D1024-1F-X-P 2048 MD1675-D2048-1F-X-P Low Profile configuration with 1024 MD1675-D1024-1F-P-V1 external LED support (PB-free Commercial 2048 MD1675-D2048-1F-P-V1 version) 7.2 uDiskOnChip-to-USB Adapter Ordering information for the uDiskOnChip-to-USB adapter: UDOC-2X5-ADPT-P 24 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L HOW TO CONTACT US USA China M-Systems, Inc. M-Systems China Ltd. 555 North Mathilda Avenue, Suite 220 Room 121-122 Sunnyvale, CA 94085 Bldg. 2, International Commerce & Exhibition Ctr. Phone: +1-408-470-4440 Hong Hua Rd. Fax: +1-408-470-4470 Futian Free Trade Zone Shenzhen, China Phone: +86-755-8348-5218 Fax: +86-755-8348-5418 Japan Europe M-Systems Japan Inc. M-Systems Ltd. Asahi Seimei Gotanda Bldg., 3F 7 Atir Yeda St. 5-25-16 Higashi-Gotanda Kfar Saba 44425, Israel Shinagawa-ku Tokyo, 141-0022 Tel: +972-9-764-5000 Phone: +81-3-5423-8101 Fax: +972-3-548-8666 Fax: +81-3-5423-8102 Taiwan Internet M-Systems Asia Ltd. www.m-systems.com 14 F, No. 6, Sec. 3 Minquan East Road Information Taipei, Taiwan, 104 info@m-systems.com Tel: +886-2-2515-2522 Fax: +886-2-2515-2295 This document is for information use only and is subject to change without prior notice. M-Systems Flash Disk Pioneers Ltd. assumes no responsibility for any errors that may appear in this document. No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without prior written consent of M-Systems. M-Systems products are not warranted to operate without failure. Accordingly, in any use of the Product in life support systems or other applications where failure could cause injury or loss of life, the Product should only be incorporated in systems designed with appropriate and sufficient redundancy or backup features. Contact your local M-Systems sales office or distributor, or visit our website at www.m-sys.com to obtain the latest specifications before placing your order. © 2005 M-Systems Flash Disk Pioneers Ltd. All rights reserved. M-Systems, DiskOnChip, DiskOnChip Millennium, DiskOnKey, DiskOnKey MyKey, FFD, Fly-By, iDiskOnChip, iDOC, mDiskOnChip, mDOC, MegaSIM, Mobile DiskOnChip, SuperMAP, TrueFFS, uDiskOnChip, uDOC, and Xkey are trademarks or registered trademarks of M-Systems Flash Disk Pioneers, Ltd. Other product names or service marks mentioned herein may be trademarks or registered trademarks of their respective owners and are hereby acknowledged. All specifications are subject to change without prior notice. 25 uDiskOnChip Data Sheet, Rev. 2.3 94-SR-003-01-8L