KONTRON VX3830-SA-00000
Specifications
Airflow
1.5 m/s without throttling at 55°C
Altitude (Operating)
-1,640 to 15,000 ft
Conformal Coating
Optional
Cooling Method
Convection
Dimensions
99.85 mm x 162.54 mm, 0.8 inch face plate (1 inch is a built option*)
FMC Interface
64 bits I/Os routed to VPX P2
Operating
0° to +55°C
Random
VIT A 47-Class V1
Relative Humidity
90% without condensation
Shock (Operating)
20g/11 ms Half Sine
Storage
-45° to +85°C
Temperature
VIT A 47-Class AC1
Vibration Sine (Operating)
20/500 Hz: 2g
VPX Interface
PCI-Express interface to VPX Data Plane 1 (P1 wafers 1 to 4). Interface to Data Plane 2 (P1 wafers 5 to 8) is a build option*
Features
- 0.8" (4 HP) or 1" (5 HP) Face Plates
- Increased I/O Flexibility and Scalable Development Solutions
- Standard Air- and Rugged Conduction-Cooled Versions
- x4 or x1 PCI-Express Backplane Interface
Datasheet
Extracted Text
» » V VX X3 38 83 30 0 « « 3U VPX Xilinx® Virtex®-5 FPGA Processor Board with FMC Site » 3U VPX Carrier Board for VITA 57 FPGA Mezzanine Cards (FMC) » Increased I/O Flexibility and Scalable Development Solutions » x4 or x1 PCI-Express Backplane Interface » Standard Air- and Rugged Conduction-Cooled Versions If it’s embedded, it ’s Kontron. FMC Connector VX3830 VX3830 is a 3U FPGA Mezzanine Card (FMC) carrier board based on a Xilinx® Virtex®-5 FPGA. VX3830 is a member of Kontron's VITA 46 VPX Ecosystem 5V +12V -12V P0 which facilitates the implementation of VPX DDR2 FPGA through an integrated offering. DP1 PCIe x4 PCIe x4 XILINX DP2 LX20T The VITA 57 FMC standard defines an I/O P1 mezzanine module connected to an FPGA located on a base-board or carrier board. It allows the 64 I/O P2 I/O interface to be physically separated from the FPGA design and thus ease I/O interface module design changes while maximizing the carrier card reuse. FMC modules are about half the size of PMC or XMC modules (similar width), but provide higher density host I/O. technical information PCI-Express interface to VPX Data Plane 1 (P1 wafers 1 to 4). VPX interface Interface to Data Plane 2 (P1 wafers 5 to 8) is a build option* FMC interface 64 bits I/Os routed to VPX P2 Dimensions 99.85 mm x 162.54 mm 0.8 inch face plate (1 inch is a built option*) * for build options, please contact Kontron Environmental Specifications SA - Standard Commercial rC - rugged Conduction-Cooled Conformal Coating Optional Standard Airflow 1.5 m/s without throttling at 55°C NA temperature VitA 47-Class AC1 VitA 47-Class CC4 Cooling Method Convection Conduction operating 0° to +55°C -40° to +85°C Storage -45° to +85°C -45° to +85°C 20/500 Hz: 2g 22/2,000 Hz: 2g Vibration Sine (operating) random VitA 47-Class V1 VitA 47-Class V3 Shock (operating) 20g/11 ms Half Sine 40g/11 ms Half Sine Altitude (operating) -1,640 to 15,000 ft -1,640 to 50,000 ft relative Humidity 90% without condensation 95% without condensation ordering information Article Part.-No. Description VX3830-SA VX3830-SA-00000 3U Air-Cooled Commercial Build, FMC carrier VPX DP1 Data Plane interface, FMC rear I/O routing on VPX P2 VX3830-rC VX3830-RC-00000 3U Rugged Conduction-Cooled Build, FMC carrier VPX DP1 Data Plane interface, FMC rear I/O routing on VPX P2 Associated Products: VX3830-rtM PB-VX3-000 3U VPX Rear Transition Module (with PIM connectors) CorPorAtE oFFiCES Europe, Middle East & Africa North America Asia Pacific Oskar-von-Miller-Str. 1 14118 Stowe Drive 17 Building,Block #1,ABP. 85386 Eching/Munich Poway, CA 92064-7147 188 Southern West 4th Ring Road Germany USA Beijing 100070, P.R.China Tel.: +49 (0)8165/ 77 777 Tel.: +1 888 294 4558 Tel.: + 86 10 63751188 Fax: +49 (0)8165/ 77 219 Fax: +1 858 677 0898 Fax: + 86 10 83682438 info@kontron.com info@us.kontron.com info@kontron.cn 2 www.kontron.com #VX3830# 11082010MB All data is for information purposes only and not guaranteed for legal purposes. Subject to change without notice. Information in this datasheet has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. All brand or product names are trademarks or registered trademarks of their respective owners.
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