AMC

PICMG AMC.0: Advanced Mezzanine Card Specification R2.0, PICMG AMC.1: PCI Express and Advanced Switching R1.0, PICMG AMC.2: Gigabit Ethernet R1.0, PICMG AMC.3: Storage Interfaces R1.0

AMC System Interconnect Gigabit Ethernet

Two 1000BASE-BX (SerDes) (Common Options Region ports 0-1)

Board Weight

Mid-size: approx. 300 grams (with heat sink, without HDD/SSD)

CE

EN55022, EN55024, EN61000-6-2/-6-3, EN300386, EN60950-1

Climatic Humidity

IEC60068-2-78

Debug Interface

JTAG port for processor emulation probe connection, Serial POST Code (LVTTL) interface on the AMC port 14
One Debug port (Extended Options Region port 14)

Dimensions

Dimensions without retention screws on front panel: Mid-size: 180.6 mm x 148.5 mm x 18.96 mm

Display Port

One DisplayPort on request (Extended Options Region ports 17-20)

DVI-D

One 29-pin VGA DVI-D connector for digital monitor

EEPROM

Serial EEPROM (24LC64) 64 kbit

FCLKA

Bidirectional PCI Express clock configuration

Flash (BIOS)

Two redundant 8 MB SPI Flash chips (2 x 8 MB) for uEFI BIOS controlled by the MMC

Form Factor

Double mid-size AMC module

Front Panel Gigabit Ethernet

Two 1000BASE-TX on RJ45 connector

Humidity

Operational: 5%-90% (non-condensing), Non-Operating: 5%-95% (non-condensing)

I/O Extension

The I/O extension holds the following interfaces: SATA, USB, LPC interface and some power and control signals, battery input

IPMI

IPMI Intelligent Platform Management Interface Spec. V2.0, IPMI - Platform Management FRU Information Definition V1.0

LEDs

Three Module Management LEDs, Four User-Specific LEDs, Ethernet LEDs

MicroTCA

PICMG MTCA.0 Micro Telecommunications Comp. Architecture R1.0, PCI Express: PCI Express Base Specification Revision 1.0a

MMC

NXP LPC2368 controller with on-chip 512 kB Flash and 56 kB RAM

MTBF

184303 h acc. Bellcore Issue 6, Ground Benign, Controlled, 30 C

NAND Flash

Up to 32 GB SLC NAND Flash on a dedicated SATA NAND Flash module

Onboard Gigabit Ethernet

One Intel 82580EB Quad Gigabit Ethernet PCI Express bus controller; Two interfaces routed to front I/O connectors, Two interfaces routed to the AMC connector

Onboard SATA

SATA extension connector for the SATA Flash module, SATA connector for connecting an onboard SATA 2.5” HDD/SSD

PCI Express

Two x4 or eight x1 PCI Express interfaces on AMC ports 4-11 (Fat Pipes Region)

Platform Controller Hub

Mobile Intel QM57 Express Chipset: Two x4 or eight x1 PCI Express 2.0 ports operating at 2.5 GT/s, SATA host controller with six ports, 3 Gbit/s data transfer rate and RAID 0/1/5/10 support, USB 2.0 host interface with up to 14 USB ports available (two USB 2.0 ports are used on the AM5020)

Power Consumption

i7-620LE (LV) 2.0 GHz: max 30 W (graphics idle), max 38 W (with graphics load); i7-610E (SV) 2.53 GHz: max 36 W (graphics idle), max 49 W (with graphics load)

Power Supply

12 V payload power, 3.3 V management power

Processor

Intel Core i7
The AM5020 supports the following microprocessors: Intel Core i7-610E (SV) processor with ECC, 2.53 GHz, 4 MB L3 cache, Intel Core i7-620LE (LV) processor with ECC, 2.0 GHz, 4 MB L3 cache; Cache Structure: 64 kB L1 cache for each core, 32 kB instruction cache, 32 kB data cache, 256 kB L2 shared instruction/data cache for each core, 4 MB L3 shared instruction/data cache shared between both cores; Further processor features: Two execution cores, Intel Hyper-Threading Technology (Intel HT Technology), Intel 64 Architecture, Intel Turbo Boost Technology, Intel Intelligent Power Sharing (IPS)

RoHS

Directive 2002/95/EC

RTC

Integrated in QM57 and CMOS RAM with backup, battery replaceable

SATA

Serial ATA: Serial ATA 2.5 Specification

Serial ATA

Two SATA ports (Common Options Region ports 2-3), Two SATA ports (Extended Options Region ports 12-13)

Serial Port

COM1 (LVTTL) (Extended Options Region port 15)
One RS232 UART interface on RJ45 connector

Software

BIOS:AMI uEFI BIOS; IPMI:MMC (Module Management Controller) implementation compliant to PICMG, AMC.0, Kontron own IP; Linux:Generic BSP to be used with various Linux derivates;, Verified for Fedora 13, RedHat 6; Windows:Windows XP SP3 / XPembedded, Windows 7 (32/64 bit), Windows 2008 Server R2; WindRiver Linux:PNE 3.x or later; VxWorks:VxWorks BSP 6.8 or later

System Memory

Dual channel DDR3 memory, up to 8 GB DDR3 SDRAM memory with ECC, running at 1066 MHz

Temperature range

-5°C to +55°C (standard, depending on processor version and airflow in the system), -25°C to +70°C (extended, depending on processor version and airflow in the system), -40°C to +70°C (storage), passive module heat sink, forced system airflow

TPM

Infineon SLB9635TT TPM 1.2 controller (on request)

UART

EXAR XR16L580IL single UART, 16550 compatible

USB

Two USB 2.0 port on 5-pin, type A Mini-USB connector

VGA

Built-in Intel 3D Graphics accelerator for enhanced graphics performance: Supports resolutions up to 2560 x 1600 pixels @ 60 Hz, Dynamic Video Memory Technology

Vibration/Shock

IEC60068-2-6 / IEC60068-2-27

Watchdog

FPGA-based, software-configurable, two-stage Watchdog with programmable timeout ranging from 125 ms to 256 s in 12 steps

WEEE

Directive 2002/96/EC